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Three-dimensional structure heat conduction network construction design ideas
Recently, the advanced electronic packaging material innovation research team led by Wang Zhengping and Sun Rong of the Chinese Academy of Sciences Shenzhen Institute of Advanced Technology has made new breakthroughs in the thermal management of electronic packaging materials. Related papers Ice-Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement Published online in the Journal of Materials (DOI: 10.1002/smll.201502173).
With the rapid development of electronic technology, the power and integration of electronic devices are increasing. Since 1959, the feature size of the device has continuously decreased, and it has progressed from micron to nanoscale, while the degree of integration has been increasing at a high rate of 40% to 50% every year. In an electronic device, a considerable portion of power loss is converted into heat, and dissipation of heat from the electronic device directly leads to an increase in the temperature of the electronic device and an increase in thermal stress, causing serious problems in the reliability and service life of the electronic device. Threats, and thus the thermal management of electronic packaging has been widely concerned by the scientific community and industry.
To solve the problem of poor thermal conductivity of traditional polymer-based electronic packaging materials, the team achieved targeted alignment of thermally conductive fillers through directional freezing technology, constructed a three-dimensional thermal conduction network, and finally prepared a new type of high thermal conductivity electronic packaging material. Compared with the traditional particles randomly distributed in the polymer system, the electronic packaging material prepared by this method has already formed a three-dimensional heat conduction network, and requires only a small amount of addition to realize the self-transmission of phonons in three-dimensional space. In turn, the thermal conductivity of electronic packaging materials is greatly improved. The research results provide a new method for the thermal management of high-performance electronic packaging materials and have a good application prospect.
The study was funded by Guangdong Province's "Advanced Electronic Packaging Materials" innovative research team and the "Advanced Electronic Packaging Materials" peacock team in Shenzhen.
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